Paper Submission
Instructions for Authors
As the ISICAS symposium will not produce proceedings, all the accepted papers will be published in four Special Issues of the IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), of the IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II), of the IEEE Transactions on Biomedical Circuits and Systems (TBioCAS), of the IEEE Transactions on Very Large Scale Integration Systems (TVLSI), of the IEEE Open Journal of Circuits and Systems (OJCAS), and of the IEEE Transactions on Circuits and Systems for Artificial Intelligence (TCASAI). The IEEE ISICAS 2025 paper submission and review process will follow the standard procedure of the journals' special issue paper submissions.
Reminder
At least one author per paper must be registered AND attend the conference to present the paper (Oral and Poster). In case of a no-show, the paper will be excluded from the special issue and will not be published. Please note that, in addition to the general scope requirement of TCAS-I/-II/TBioCAS/TVLSI/OJCAS/TCASAI, for the ISICAS special issue, manuscripts on analog and mixed-signal, nonlinear, communications, power, and biomedical circuits must have an on-chip implementation and measured silicon results. Manuscripts on digital circuits and systems and VLSI must have at least FPGA verification. Submissions not compliant with the above requirements will not be reviewed and will be returned to the authors. Extended versions of recently published conference papers with significant additional materials are also welcome.
Final Submission Deadline
| Journal | Final Extension Deadline |
|---|---|
| IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I) | March 6, 2025 |
| IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II) | March 6, 2025 |
| IEEE Transactions on Biomedical Circuits and Systems (TBioCAS) | March 20, 2025 | IEEE Transactions on Very Large Scale Integration Systems (TVLSI) | March 20, 2025 |
| IEEE Open Journal of Circuits and Systems | March 20, 2025 |
| IEEE Transactions on Circuits and Systems for Artificial Intelligence (TCASAI) | March 6, 2025 |
Paper Preparation and Submission
Prospective authors are invited to submit full-length papers with a complete description of their integrated circuits and systems implementations and collected measurement results. Extended versions of previously published recent conference papers with significant additional materials (conforming to the rules of TCAS-I, TCAS-II, TBioCAS, TVLSI, OJCAS, and TCASAI see below) are also welcomed.
Manuscripts must follow the standard single-spaced, double-column IEEE Transactions format, as specified at the following link: http://ieeeauthorcenter.ieee.org/create-your-ieee-article/use-authoring-tools-and-ieee-article-templates/ieee-article-templates/templates-for-transactions/
Detailed instructions for papers submission
IEEE TCAS-I
https://ieee-cas.org/publication/TCAS-I
Instructions for IEEE TCAS-I authors:
https://ieee-cas.org/publication/TCAS-I/tcas-i-manuscript-submission-guide
Requirement for IEEE TCAS-I Submission:
Include FPGA-based hardware implementations
IEEE TCAS-II
https://ieee-cas.org/publication/TCAS-II
Instructions for IEEE TCAS-II authors:
https://ieee-cas.org/publication/TCAS-II/tcas-ii-manuscript-submission-guide
IEEE TBioCAS
https://ieee-cas.org/publication/TBioCAS
Requirement for IEEE TBioCAS Submission:
Custom-designed CMOS ICs for biomedical applications and NOT on FPGA/CPU/GPU-based hardware implementations.
Instructions for IEEE TBioCAS authors:
https://ieee-cas.org/publication/TBioCAS/tbiocas-manuscript-submission-guide
IEEE TVLSI
https://ieee-cas.org/publication/tvlsi
Instructions for IEEE TVLSI authors:
https://tvlsi.ieee.org/index.html
Requirement for IEEE TVLSI Submission:
TVLSI emphasizes system-level innovations or implications across system, chip, and package levels, as well as HW/SW integration. It focuses on large-scale systems-on-chip (SoCs), FPGA-based designs, 2.5D/3D chiplet-based systems-in-package, system-on-interposer, or multi-die integrations, including die-to-die interfaces. Contributions should address holistic platform design challenges beyond single IC components.
IEEE OJCAS
https://ieee-cas.org/publication/OJCAS
Instructions for IEEE OJCAS authors:
https://ieee-cas.org/publication/OJCAS/ojcas-manuscript-submission-guide
IEEE TCASAI
https://ieee-cas.org/publication/ieee-transactions-circuits-and-systems-artificial-intelligence
Instructions for IEEE TCASAI authors:
Requirement for IEEE TCASAI Submission:
No quantum computing, Include FPGA/CPU/GPU-based hardware implementations.
IMPORTANT
When submitting a paper for ISICAS 2025 (either for TCAS-I, TCAS-II, TBioCAS, TVLSI, OJCAS and TCASAI), please select the option ISICAS 2025 Special Issue.
Plagiarism and excessive re-use of earlier material
Papers submitted for ISICAS 2025 will be checked for plagiarism and improper re-use of authors’ earlier material using IEEE CrossCheck (click here).